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Marking Solutions For Electronic Components And Integrated Circuit Boards

2024-09-14 Visits:

For reasons of traceability, quality assurance, and trademark protection, most casings used for electrical or electronic components must be labeled with simple alphanumeric codes, complex QR codes, identification, or custom data. Electronic components and integrated circuit boards are equipped with machine-readable permanent solder mask laser markings to ensure accurate identification and traceability of parts, which in turn ensures a flawless quality assurance process throughout the entire life-cycle chain and process. Laser marking is an economical, efficient, and safe marking process that can meet these requirements.

The JHX Laser fiber laser marking machine adopts high-speed scanning galvanometer, high-performance imported laser, and our company's dedicated control software to perform high-precision marking on electronic components, integrated circuits, printed circuit boards, etc.

Recommended models:Fiber Laser Marking Machine

光纤激光打标机JHX-200200G-750.jpg

Model:JHX-2020G

Product features

1.High speed scanning galvanometer, high-performance imported laser, accurate precision, stable performance, fast speed, high-precision lifting working platform, realizing stable and reliable operation for a long time, simple operation, convenient use and clear marking.

2.The control software adopts windows engineering interface, which is compatible with CorelDraw, AutoCAD, Photoshop and other graphic output file formats, such as PLT, PCX, DXF, BMP, etc. At the same time, SHX and TIF word libraries are directly used to design graphics freely through compute;

3. Using fiber laser, the beam quality is good, the laser beam is fine, the processing material consumption is small, and the processing heat affected zone is small.

Application material and Industry

1.Leather, cloth, wood products, paper, plexiglass, epoxy resin, acrylic, unsaturated polyester resin and other non-metallic materials;

2.All kinds of metals and alloys; Rubber, ceramic, coating, stone, silicon wafer; Epoxy resin, ABS and other non-metallic materials.

Application examples

应用实例拼图.jpg



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